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Sputter Deposition Processing

Sputtering and other types of physical vapor deposition are a mainstay of our business. We consistently produce our own sputtering targets and deposit films on numerous substrate materials. A large portion of our work in the sputter deposition realm supports programs for DoD prime contractors and other DoD entities. Our sputter deposition processing capabilities include:

  • DC and Bipolar Pulsed DC Magnetron Sputtering
  • Low (45kHz) and Medium Frequency (400kHz) AC Magnetron Sputtering
  • RF (2.0 & 13.56 MHz) Magnetron Sputtering
  • Ion Assisted Deposition; DC and AC Substrate Biasing
  • Sample Heating with Various Types of Motion (linear, rotary, etc.)
  • Etch and Sputter Coating of Parts up to 36” Diameter